Yeky Parng
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Yeky Parng
VP at ITG Electronics (M) Sdn Bhd
Johor, Malaysia
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In-Tec Global (ITG) is a producer of low, medium and high volume sophisticated electronic assemblies with an emphasis on exceptional quality. ITG, established in December 1994, expanded into Malaysia in 1995. With factories located at the border of Malaysia and the head office in Singapore, ITG is easily accessible from downtown Singapore in just 40 minutes or 15 from the Singapore

Our Achievement

Continuous quality improvement program is implemented in In-Tec Global to ensure that our products are manufactured according to state of the art quality processes and practices.Our facilities are certified to ISO-TS16949:2009, ISO9001:2009, ISO13485:2003, AS9100:2001 and ITG Quality Policy.

Our Facilities

In-Tec Global operates 2 factories located in Tampoi, Malaysia (10km from Singapore causeway).

Excellent accessibility to major International Airport and Seaports

Land area - 90,000 SQ FT (Build up approx. 60,000 SQ FT)

Manufacturing area - 45,000 SQ FT and Office area - 15,000 SQ FT

Manufacturing facilities are located in Malaysia and office headquartered in Singapore. Deploying the latest in SMT equipment along with over 25 wire bonders, located in class 10,000 clean rooms. Our work-force totals more than 500 employess, which run on 2 shifts.

We employ a detailed quality plan for each of our customers, which include a customer certification program, an in-coming quality plan, an in-process audit plan, and an out-going plan with specific PPM targets.

SMT - 200K units per month based on an average of 500 components per board.

COB - 500K DIES per month based on an average of 100 wires per DIE

Final assembly - 1 Million units a month based on products such as; Hand held organizers and Corded/Cordless telephones.

Process Flow

Solder paste / Epoxy printing

SMC Placement / BGA (click for more details)

Reflow Soldering / Epoxy curing

- Washing / COB (click for more details) / Testing

- Taping / Manual insert

Wave soldering

- Aqueous cleaning

VMI / Touch up

ICT/ATS

Final Assembly (click for more details)

Final test

QA Buy-off

Our Services

Production

The ability to develop a complete process per customer’s requirement to produce PCBA, finished products or full systems by the following technologies:

SMT COB / COF (AL/AU Wire Bonding)

Heat seal / hot bar Tampo Printing

Ultrasonic Welding Solder wave (RoHS compatible)

BGA Conformal coating

Products

Capability to manufacture products covering a full range of industries:

Industrial controls Consumer electronics

Automotive Office equipment

Security, Safety & Lighting systems Aerospace

Medical devices Telecommunication

Design/Development

Capability to manufacture products covering a full range of industries:

Complete product development service provided in-house.

Product design service with our regional design house partners.

Material

Full Turn-key capability.

Quick turn around time.

Consignment stock if desired.

Ability to source high quality low cost alternatives.

Flexible ordering system and logistic management (Drop ship to any world wide location designated by our customers)

Products and Application

Automation

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Automotive

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Biomedical

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Industrial Controls

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Consumer Products

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Sensor

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Telecommunication

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