AcSiP, as the name literally implies, we are an “Advanced Communication SiP” solution provider. We provide series wireless connectivity solutions. Our product line include WiFi, Bluetooth, GPS, LTE and even customized module for machine-to-machine (M2M) or Internet of Things (IoT) applications.
For our customers, AcSiP can also support RF Design, compact module design with miniaturization technologies, multi-chips integration, antenna simulation, wide range software support and even on-site support for optimizing customer’s manufacturing process.
For the booming Internet of Things (IoT) applications, AcSiP is delivering multiple wireless solutions which can simplify customer’s development efforts. We offer comprehensively products portfolio, and even customization services for customers to get their connected products much easier and faster. We devote ourselves to wireless communication technologies and to be a value added partner for our customers.
MCU + WiFi + ANT
The AI6060H integrate chip antenna and 4Mbits flash to reduce customer platform size. And also integrate power manage unit for single 3.3V power source for cost effective design.
The AI6060H embedded 32-bit RISC MCU for 802.11b/g/n drivers, supplicant, TCP/IP protocol stack, and networking applications, can be operated in station mode and softAP mode. The AI6060H is an ideal solution for embedded device to enable networking service with minimized design effort.
4 in 1 Combo SiP
IEEE 802.11b/g/n, BT 2.1+EDR, FM T/Rx, GPS
SDIO / UART / Audio / PCM / I2S
WiFi b/g/n module
AcSiP Technology Corp. introduces a low-cost and low-power consumption Wi-Fi SiP module. The module is targeted to mobile devices including smart phone, PDA, Wi-Fi phone, DSC, DVC, IOT Device which need small Wi-Fi module. The highly integrated module allows the usage of web browsing, VoIP application.
The wireless SiP module support IEEE 802.11b/g/n standard and it can provide up to 72Mbps (GI=400ns) for IEEE 802.11n, 54Mbps for IEEE 802.11g, 11Mbps for 802.11b to connect your wireless LAN.
AcSiP Technology Corp. introduces a low-cost and low-power consumption IoT SiP module. The module is an operating system designed for Wearables and Internet of Things (IoT) devices that can connect to other smart devices or directly to cloud applications and services.
The S78S is designed & manufactured in a smallest form factor - SiP ( System in Package ). It integrate with Semtech SX1278 and a 32-bit ultra low power Cortex M0L MCU ( STM32L073x ), supporting global 433 MHz or 470 MHz ISM-Bands
Capable of 2-way communication and reach over 16 km ( 10 miles ) distance in our field test.
This product is designed with multiple easy to use interface ( I2C/SPI/UART/GPIO ), fine-tuned RF performance and will be offered with complete SDK library & ready to go HDK, it can significantly help the users to shrink the size of end device and simplify the development efforts for any LoRa applications.