Mike Kang
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Mike Kang
Sales Representative at Mutual-Tek Industries Co. Ltd
New Taipei, Taiwan
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https://www.hwtrek.com/profile/mike-kang.4959
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Mutual-Tek was founded in 1990, and has developed into a top class PCB supplier for prototypes offering the best value, efficient production, and low price.

We strive to offer a total solution for PCB and R-F, and have for the past 20 years, continued to innovate our capabilities and technologies to meet the demands of our customers.

Therefore, we have extensive experience in traditional PCBS, multi-layer HDI, ultra-thin PCB, etc.

Facilities

  1. Taiwan Site: It is located in Huacheng Rd, Xinzhuang City, and dedicated to Rigid-Flex board and HDI technology. The capacity is 250,000 sq-ft.
  2. China Site: It is located in Chimen Rd, Changsu. The china site is 11.2 hectares. The factory one was built in 2008 and its capacity is 400,000 sq-ft. The factory two started its construction on March, 18th, 2012 and it was estimated to be done in 2012 and start mass production in 2013. The capacity was planned to be 30,000 sq-ft. In 2013, the capacity will be 50,000 sq-ft.

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Products

(1) Rigid Flex PCB(RF)

Rigid Flex Board conforms with the light, thin, short and small design demand, and it has perfect signal transfer performance/function. Advantages:

  1. High quality of reliability and signal completeness.
  2. Decreasing the weight and Reducing space compared with traditional PCB after assembling.
  3. Providing various shape type possibility and reducing cost of operation. (We provide customize-shaped )

Products applications:

  1. Camera Module for Smart Phone.
  2. Camera Module for NB and Tablet
  3. Optical Camera Application
  4. Battery Module
  5. Bluetooth
  6. SSD Application

Why Mutual-tek :

  1. Manufacturing ourselves in whole process
  2. Various choice of finishing, such as ENIG, ENEPIG, Plating Gold.
  3. Capability : 10 Layers Plus 2 HDI RF, 2mil/2mil trace, Min. Thick 0.2mm (4layer).
  4. Shipping quantity up to 40KKpcs in 2011.
  5. Other capability detail please see - Capability.

Camera Module for Smart Phone

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(2) High Density Interconnect PCB (HDI)

HDI PCB has matured technology and applied to plenty of 3C products. Mutual-tek has more than 20 years of manufacturing experience for HDI PCB. We have:

  1. Camera Module for Smart phone.
  2. Optical Sensor of Game Machine
  3. DSLR and DV Optical Module
  4. Optical Camera Application
  5. Main Board of Smart Phone

The Advantages of Mutual-tek :

  1. Manufacturing ourselves in whole process, such as ENIG, ENEPIG, Plating Gold.
  2. Capability : 10 Layers Plus 2 HDI, 2mil/2mil trace, Ultra thin HDI.
  3. Other capability detail please see - Capability.

Camera Module for NB and Tablet

2012-pro_02_002e_S_2012-pro_02_002_S_pro-02a-002s.jpg

2012-pro_02_001e_S_2012-pro_02_001_S_pro-02a-001s.jpg

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(3) Ultra thin PCB

Main board of ICash and pass RFID card

Features:

  • Max. thick is 0.134mm
  • trace width and space are 3mil / 3mil
  • Product have been qualified and enter MP.

thin_app_01.jpg

Applications:

  • Main board of I Cash and pass RFID card

Advantages:

  • Providing a safe and reliable business module.

Features:

  • Max. thick is 0.134mm
  • trace width and space are 3mil / 3mil
  • Product have been qualified and enter MP.

Main board of Credit and Debit card

Features:

  • Max. thick is 0.134mm
  • trace width and space are 3mil / 3mil
  • Product have been qualified and enter MP.

thin_app_02.jpg

Applications:

  • Main board of Credit and Debit card

Advantages:

  • Creating functions for memory, identification, code and transfer. Providing a safe and reliable business module.

SIM card for mobile phone (COB)

Features:

  • Thick is from 0.2mm to 0.3mm
  • trace width and space are 3mil / 3mil
  • 2 layers and 4 layers are available
  • Product have been qualified and enter MP.

thin_app_03.jpg

  • SIM card for mobile phone (COB)

Advantages:

  • Creating functions for memory, identification, code and transfer. It combines with e-money function.