I am working in IT industry for 15 years in Taiwan as FAE, Sales , Product marketing . I would like to see anything new in the future.
ABOUT Dai-ichi Seiko:
I-PEX is a connector brand of DAI-ICHI SEIKO. We offer high quality small size connector manufactured in-house.
I-PEX “Perfection in Precision” manufacturing technologies provides the basis for high frequency and high data rate solutions that feature very small connectors produced at the highest quality levels.
High speed Micro-Coax connector: CABLINE and FPL series capable of handling high data rates providing 360 degree EMI shielding. Applications include connecting displays, camera modules, storage devices and others .
High density FPC connector: MINIFLEX series FPC/FFC LIF back flip style connectors with pin pitch of 0.5, 0.4, 0.3, 0.25, 0.175mm. Height profiles range from 2.00 to 0.55mm. Auto-locking FFC connector with shielding options: EVAFLEX series FPC/FFC “AUTO LOCK” style connectors include EMI shielding option and support high data rate transmission.
High frequency micro RF connector: MHF series used to connect antennas to radios for WiFi, Bluetooth, GPS, 4G and other wireless technologies. RF switch connector: MHF SW Series micro RF switches commonly used on production assemblies to test radio performance. Robust docking connector: MINIDOCK series used for module and device docking in medical, test, and industrial instrument applications. Easy docking accomplished with LIF contacts, extended guide pins, and rugged die cast housings. 10,000 mating cycles, 80-240 pins.
- Micro RF Coax Connector
- Docking Connector
- FPC/FFC Connector
- Bpard-to-Board Connector
- Board-to-Wire Connector
- Automotive Connector Series
- ISH Connector
- Combined PCB Connector
- Automotive Parts Series
- Insert Molded Parts (Sensors)
- Automotive Parts( Control Unit)
- IC Case
- Smart Entry Key
- Hard Disk Drive(HDD) System Parts
- Water Meter
- LCD Panel Frame
Mold & Mfg. Equipment
- Full Automatic Semiconductor Molding Machine
- Manual/ Semi-auto Molding Machine
- Taping and Detaping Machine for MAP QFN
- Mold for IC Packaging
- Light Guide Plate Processing Equipment ( For LED LGP Processing)
- Peripheral Device for Injection Molding