Fifi Wang
Fifi Wang
Sales Manager at Shenzhen AOCHUAN Technology CO., LTD
Shenzhen, China
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Shenzhen AOCHUAN Technology CO., LTD was established in 2004, is a leading Chinese developer and manufacturer of products for Thermal Interface Materials. It's honored by government of the "Shenzhen Hi-Tech Enterprise" in 2008 and the "National Hi-Tech Enterprise" in 2013, Being approved by institutions of the third party such as UL and SGS, the company is qualified as "standard" enterprise, authorized by the ISO9000 and ISO14001 system.AOK(Trademark of Shenzhen Aochuan Technology Co.,Ltd) have developed a comprehensive range of choices for thermal interface materials which include thermal grease, thermally conductive gap filler, thermal conductive insulators and phase change materials, which satisfy the requirement of heat dissipation well in an extensive variety of applications, as well as widely applied to medical devices, automotive, telecom and military industries.

Today, AOK has established long-term business relationships successfully with more than 65 countries in the world. AOK have a long-term cooperation with Foxconn Technology group, LG, BYD, BenQ, CHANGHONG, TPV and other domestic and medium-sized enterprises all over the world.



Shenzhen Aochuan Technology Co., Ltd established in 2004, is a world leading Chinese developer and manufacturer of thermal interface materials products. Using thermal interface materials to improve Heat Sink thermal performance.

Thermal management solutions

The general 3C electronic products will have a thermal management problem. Today’s electronics are smaller and more powerful than ever, leading to ever increasing thermal challenges for the systems designer. While fans, heat sinks, and even liquid cooling and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling.

Thermal pads provided by AOK are used in a wide variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices, and the automotive industry.

AOK™ Thermal Management Interface Materials

Proven, high performance solutions for cooling high intensity LEDs, bonding heat sinks, heat spreaders and other cooling devices to IC packages and power transistors. A variety of specific? Compounds are available for a wide range of performance requirements in Sheets, Rolls, Die-cuts, Sleeves, Gel, Extrusions, Moldings.

AOK™ All Types of Thermal Materials Application Guidelines


Applied on chips to satisfy the requirement of heat dissipation. Please see below: